Size reduction processing, plating, and other processing services.
We are utilized by many customers for device development and evaluation, various material development and evaluation, device parts, and customer prototypes and research and development.
Since our founding, we have built a network of trust over the course of half a century, enabling us to handle processes such as wafer size reduction, cleaning, and plating. If you have any thoughts like, "Can you do this kind of processing...," please feel free to consult with us. For more details, please download our catalog or contact us.
- 企業：大村技研
- 価格：Other
